Kulicke and soffa 4700AD Ball and Wedge Wire Bonding machine

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4700AD provides the high yield and excellent repeatability needed for every wedge and ball bonding application, including: optoelectronic modules, hybrid/MCMs, microwave products, discrete devices/lasers, Chip-on-Board. Wedge or Capillary mounting is easy and precise with a special transducer, unique to K&S Model 4700. Applications ranging from the basic type to the most challenging are handled with ease and with the versatility demanded by today's leading research or production requirements.

o Uses and Application:
Used in wire bonding and packaging of micro electro mechanical chips.

o Features Include:
 Wedge-wedge and ball-wedge bonding on the same machine
 Increased 'Z' travel; 12.5mm
 90-degree deep access wedge bonding with 0.750" wedge length
 Ball bonding with 0.375", 0.437" or 0.625" capillary length
 High-end Negative EFO with missing ball detection
 Wire Spool holders for ½" and 2" spools
 2 Channel Independent Bonding Parameters
 Semi-Auto and Manual Z Bonding Modes
 Built-in Digital Work Stage Temperature Control
 Nikon SMZ 660 microscope, 5x Zoom, 20x Eyepiece pair
 K&S Video Microscope system
 Small spot target, green dot <0.001" (25μm)
 Clamp 90-degree Ribbon wire feed for deep access
 Mini-heater support bracket for wedge
 Workholders (see K&S Workholder Catalog below):

o 04142-0X05-000-01

o 04135-0X01-000-01

o 04142-0X26-000-01

o 04135-0X06-000-01

 0.7mil (17.5μm) and 1mil (25μm) Al wire for wedge bonding  0.7mil (17.5μm) Au wire for ball bonding and 1mil (25μm) Au wire for wedge bonding.